HOREXS semiconductor ic package substrate With Chip Wire Bonding
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Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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