Best Quality High Thermal Conductivity GPU CPU Thermal Gap Pads
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...Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typically made of a flexible material such as silicone, which can be easily cut or trimmed to fit a wide range of applications. Thermal pads serve the same purpose as every other form of thermal......
Trumony Aluminum Limited
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TIF100-66U Custom Laptop Hard Drive GPU CPU Thermal Conductive Pad
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Custom Laptop Hard Drive GPU CPU Thermal Conductive Pad The TIF™100-66U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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UL And RoHs 3.0mmt Cpu Thermal Gap Pad 20 Shore 00
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...Pads for CPU,20 Shore 00 The TIF1120-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0. TIF100-30-02US-Datasheet-REV02.pdf Features > Good thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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1.5 W/mK Blue LED Thermal Gap Pad Easy With Heat Sink LED Lighting COB CPU GPU
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...Thermal Gap Pad Easy With Heat Sink LED Lighting COB CPU GPU TIF100-05S Datasheet-REV02.pdf The TIF140--15-5S Series ) is an extremely soft gap filling material rated at a thermal conductivity of 1.5W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
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... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
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Grey Thermally Conductive Gap Filler Pads Electronic Thermal Gap Pad Material
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Thermal Pad Gap Filler Laird Tflex SF10 10 W/Mk Thermal Conductivity Die Cutting...
ZSUN CHIPS CO., LTD
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OEM / ODM Laptop GPU CPU Silica Gel Thermally Conductive Pad
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OEM / ODM Laptop GPU CPU Silica Gel Thermally Conductive Pad Product Name adhesive backed rubber pad Color Black Hardness 50-70Shore Product Form Rollstock Roll Width 0.3-10mm Shape Custom-made Material NBR,......
KKG Electric Co., Ltd.
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AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity
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Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~......
Shenzhen Aochuan Technology Co., Ltd
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Odm Metal Stamping Parts Laptop Gpu Cpu Vga Chip Ram Heatsink Sheet 1.2kg Thermal Pad
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Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad Material Aluminum Alloy,Steel or Customized Color Customized MOQ 1pc Sample Acceptable Certification CE, RoHS, GS, ISO9001 Inspection 100% inspection Tolerance +/-0.1mm ......
Nanpi Xinchengweiye Hardware Products Co., Ltd.
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Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad
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Aluminum Heat sink thermal Pad for Laptop GPU CPU VGA Chip RAM Heat sink sheet Quick Details: Material: aluminum (stainless steel, Iron, brass) Machining process: stamping machining (punching lathe 40T, five sets) Finishing: Polishing, Silver oxidation, ......
LiFong(HK) Industrial Co.,Limited
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