PLC Control Auto Semiconductor Encapsulation Equipment Semiconductor Making Machine
|
...200 MPa Screw Diameter: 35 Mm Auto Transfer Molding Auto Packaging Equipment Performance Parameters ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/......
Guangdong Taijin Semiconductor Technology Co., Ltd
|
Semiconductor Encapsulation Sleeve Barrels Tungsten Carbide Plunger Pot
|
Semiconductor Encapsulation Sleeve Barrels Tungsten Carbide Plunger Pot Other Name: Tungsten steel sleeves, carbide bushings, Semiconductor encapsulation sleeve barrels with tungsten carbide plunger pots are specialized components used in semiconductor manufacturing processes. Semiconductor encapsulation sleeve barrels with tungsten carbide plunger pots are essential in ensuring the reliability, precision, and quality of semiconductor......
Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd
|
Auto Capsule Encapsulation Machinery Pharmaceutical Capsule Filling Machine
|
2020 New Auto Capsule Encapsulation Machinery Pharmaceutical Capsule Filling Machine After-sales Provided Engineers available to service machinery overseas Filling Machine Model ......
Guangdong Rich Packing Machinery Co., Ltd.
|
Auto Small Soft Gel Capsule Filling Machine Encapsulation Equipment Siemens Touch Screen
|
Auto Small Soft Gel Capsule Filling Machine Encapsulation Equipment Siemens Touch Screen Application and Usage: Softgel encapsulation machine can quantificationally inject the oil, mixing suspension and pasty mass into the capsule to form all kinds of softgel encapsulation with different size, shape and color. Because of the merits of high speed disintegration, easy to oral, hard to oxygenation, easy to store and take, the softgel encapsulation...
Leadtop Pharmaceutical Machinery
|
Auto Paintball Softgel Encapsulation Machine Pharmaceutical Filling And Packaging
|
Automatic Paintball Making Pharmaceutical Filling Packing Machine for Micro Fish Oil Paintball Softgel A detailed introduction of the product: HRS250 full automatic soft gelatin encapsulation machine Integrated the latest global encapsulation technology......
WENZHOU URBAN PACKLINE CO., LTD.
|
Precision Glass Encapsulated NTC Thermistor Suppliers Easy Automatic Installation
|
Precision Glass Encapsulated NTC Thermistor Suppliers Easy Automatic Installation The MF58 is a NTC thermistor which is manufactured using a combination of ceramic and semiconductor techniques. It is equipped with tinned axial leads and then wrapped with ......
Hefei Minsing Automotive Electronic Co., Ltd.
|
1AM IC SOT-23 Plastic Encapsulate Transistors MMBT3904 NPN
|
MMBT3904LT1G MMBT3904 2N3904 3904 TRANS NPN SOT23 1AM IC SOT-23 Plastic-Encapsulate Transistors NPN 40V 200mA 1AM 100-300 SOT-23 Plastic-Encapsulate Transistors MMBT3904 TRANSISTOR (NPN) FEATURES z Complementary to MMBT3906 MARKING:1AM MAXIMUM RATINGS (T ......
LU'S TECHNOLOGY CO., Ltd.
|
TIP122 TIP127 Semiconductor Triode TO-126 Plastic Encapsulated Transistors
|
TO-126 Plastic-Encapsulate Transistors TIP122 Darlington Transistor (NPN) TIP127 Darlington Transistor (PNP) FEATURE Medium Power Complementary Silicon Transistors TO-126 1. EMITTER 2. COLLECTOR 3. BASE MARKING TIP122 , TIP127=Device code Solid dot = Green......
Shenzhen Hua Xuan Yang Electronics Co.,Ltd
|
Plastic PA66 Encapsulation Fast Blow 19x5.2x19.2mm Auto Blade Fuse ATO 32V 58V 60V 80V 3Amp Violte Max Medium Sized
|
Plastic PA66 Encapsulation Fast Blow 19x5.2x19.2mm Auto Blade Fuse ATO 32V 58V 60V 80V 3Amp Violte Max Medium Sized General The Aolittel AB19 Blade Fuse is an ATO style blade fuse rated at 32V/58V/60V/80V, featuring a three part construction with copper ......
Aolittel Technology Co.,Ltd
|
Thick 650um 4 Inch Single Crystal InP Semiconductor Substrate
|
2inch InP wafers 3inch 4inch N/P TYPE InP Semiconductor Substrate Wafers Doped S+/ Zn+ /Fe + growth (modified VFG method) is used to pull a single crystal through a boric oxide liquid encapsulant starting from a seed. The dopant (Fe, S, Sn or Zn)is added......
SHANGHAI FAMOUS TRADE CO.,LTD
|
Submit your “auto semiconductor encapsulation” inquiry in a minute :