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High Temperature Resistant PUR Piezo Valve with Luer Connector for High Viscosity Materials

Categories Dispensing Valve
Brand Name: HSTECH
Model Number: HS-YD-PUR300CC
Certification: CE
Place of Origin: China
MOQ: 1 PC
Price: Negotiable
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100 sets per week
Delivery Time: 7~9 work days
Packaging Details: Carton package
Product Name: PUR Piezo Valve
Application: Bonding And Sealing Of Cell Phone Shells
Weight: 15Kg
Material In Contact With Fluid: Stainless Steel 303, Special Steel
Fluid Inlet Size: Luer Connector
Applicable Viscosity Range: 0-20000cps
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High Temperature Resistant PUR Piezo Valve with Luer Connector for High Viscosity Materials

High Temperature Resistant Material PUR Piezo Valve with Luer Connector​


Principle & Control


PUR Piezo Valve

  1. The PUR Piezo valve is composed of several modules: a barrel heating module, a pressurized cap module, a nozzle heating module, a runner module, a valve body module, and a heat dissipation module.
  2. The barrel heating module supports the barrel and features a controllable heating section for the initial warming of the gel.
  3. The pressurized cap module ensures the barrel is sealed and pressurized, adjusting the output pressure through a controller.
  4. The heat dissipation module is responsible for dissipating heat and reducing noise emitted by the valve body.
  5. The Piezo-electric injection valve adopts a modular design, where the gel-contacting part is the runner module and the non-contacting part is the valve body module.
  6. Based on specific applications, the runner module can be replaced to meet different dispensing needs.
  7. Nozzle diameters vary from 0.03MM to 0.80MM and come in flat jet, needle, and extension styles.
  8. Runner modules need regular cleaning in an ultrasonic cleaner. It's crucial to avoid immersing seals in organic solvents and to use specialized tools for nozzle cleaning to prevent damage.

Piezo Valve Controller

  1. The touch screen operates the piezoelectric injection valve and dispensing system, supporting robust, safe, and reliable 485 communication for control.
  2. The touch screen features a graphical control interface that clearly and intuitively displays the dispensing system components and control functions.
  3. Nozzle Heating Device: Before dispensing, it's necessary to heat the nozzle to an appropriate temperature using the single-stage heating mode of the heating device.
  4. Maintaining a constant temperature at the nozzle ensures optimal gel performance by preserving its best qualities.

Nozzle and drum heating

  1. Prior to glue dispensing, the nozzles undergo a two-stage heating process to reach an appropriate temperature.
  2. Maintaining a consistent temperature for the glue by heating both the barrel and the nozzle ensures its optimal performance.

Specification

ModelHS-YD-PUR30CCHS-YD-PUR300CC
Size (L*W*H)120mm*50mm*140mmSee attached drawing
Weight0.75kg1500g
Material in contact with fluidStainless steel 303, special steelStainless steel 303, special steel
Fluid inlet sizeLuer connectorLuer connector
Needle assemblyTungsten steel wear-resistant material Φ0.6-Φ3.0mmTungsten steel wear-resistant material Φ0.6-Φ2.1mm
Nozzle assemblyTungsten steel wear-resistant material Φ0.03~0.8mmTungsten steel wear-resistant material Φ0.05~0.3mm
Heating assembly20~220℃20~220℃
Fluid sealsHigh temperature resistant materialHigh temperature resistant material
Maintenance intervals for seal assemblies20,000,000 times20,000,000 times
Maximum dispensing frequency1000Hz (Instantaneous maximum frequency 1500Hz)1000Hz (Instantaneous maximum frequency 1500Hz)
Maximum drive power100%100%
Type of glue usedPUR hot melt adhesive 300CC aluminum cylinder packagingPUR hot melt adhesive 300CC aluminum cylinder packaging
Applicable viscosity range0-20000cps0-20000cps
Fluid temperature range80~220℃20~220℃

Product Features and Advantages


  1. Tube heating is perfect for 300CC aluminum tubes filled with special hot melt glue.
  2. Its modular design makes parts easy to replace and debugging straightforward, while also offering a wide range of application processes.
  3. The spraying volume can achieve precision as low as 0.3nL, with a glue point consistency accuracy of up to 98%.
  4. During the hot melt adhesive spraying process, it can achieve a minimum line width of 0.17mm and a minimum spot diameter of 0.15mm.
  5. It is compatible with any motion platform currently available on the market.

Application Field

Bonding and sealing tasks encompass a variety of applications, such as assembling cell phone shells, encapsulating new energy batteries, adhering and sealing touch screens for diverse electronic devices, enclosing cell phone speakers and receivers, covering high-end headphones and audio housings, as well as encapsulating fingerprint recognition modules.

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