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AB Glue Fiber Optic Materials Optical Fiber Curing Adhesive Epoxy Resin Original

Categories Fiber Optic Materials
Brand Name: EPO-TEK
Model Number: 353ND
Certification: ISO9001
Place of Origin: United States
MOQ: Negotiable
Price: Negotiable
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 100 sets per week
Delivery Time: 3-7 working days
Packaging Details: EPE and carton packaging
EINECS No.: 429-840-1
Type: epoxy resin
Color: A black, B amber
Shelf life: 12 Months
Active period: 180(min)
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AB Glue Fiber Optic Materials Optical Fiber Curing Adhesive Epoxy Resin Original

AB Glue Fiber Optic Materials Optical Fiber Curing Adhesive Epoxy Resin Original


Two component heat curing epoxy adhesive, also known 353ND fiber bonding agent for the production of optical component, widely used in the production of fiber optic connectors.


Product NameHigh Temperature Epoxy EPO-TEK 353ND FIber Optic Epoxy Glue
Module Type353ND FIber Optic Epoxy Glue
Coloramber
Consistancypourable liquid
Viscosity (mixed)3000~5000 cps
Glass Transition Temp12°C

Features


Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.


• NASA approved, low outgassing epoxy


• Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.


• Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging


• Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions


• Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:


• Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range


• Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays


• Medical suggested applications:


• Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasma.


• Certified to USP Class VI Biocompatiblility Standards for medical implants; adhesive for catheter devices including stents and guide wires


• Electronics Assembly suggested applications:


• Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices


• Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.


• Structural grade epoxy found in Hard-Disk drive devices; bonding of SST metals, kapton, and magnets

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