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10 Layer 1.6 MM HDI PCB Thickness FR4 TG 170 Material

Categories HDI PCB
Brand Name: WITGAIN PCB
Model Number: HDIPCB0014
Certification: UL
Place of Origin: China
MOQ: 1pcs/lot
Price: negotiable
Payment Terms: T/T
Supply Ability: 100kpcs/Month
Delivery Time: 25 days
Packaging Details: vacuum package in bubble wrap
Layer Count: 10 Layer
Board Thickness: 1.6MM
PCB Kind: HDI PCB
Min Hole: 0.1MM
Impedance Control: 100 Ohm
Surface Treatment: Immersion Gold 3U'
Size: 100mm*95mm/1pcs
BGA Size: 9.45 MIL
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10 Layer 1.6 MM HDI PCB Thickness FR4 TG 170 Material

HDI PCB 10 Layer 1.6 MM Thickness FR4 TG 170 Material


PCB Specifications:


1 Part NO: HDIPCB0014

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 3+N+3 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L1-L3 0.1MM, L3-L8 0.1MM, L8-L9 0.1MM, L9-L10 0.1MM, L8-L10 0.1MM, L1-L100.2MM

5 Min Lind Space&Width: 2.0/2.4mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Industrial Control

8 PCB Size: 100mm*95mm/1pcs


Our production applications:


1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.


PCB report have to include the following information:


1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;

2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;

3 Other: date code, quantity etc.


S1000-2 Data Sheet:


S1000-2
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC180
IPC-TM-650 2.4.24.4DMA185
TdIPC-TM-650 2.4.24.65% wt. loss345
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin20
T300IPC-TM-650 2.4.24.1TMAmin5
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
E-24/125MΩ.cm4.5 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
E-24/1251.7 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.38
125℃N/mm1.07
Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
CWIPC-TM-650 2.4.4AMPa518
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.1
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

Product Tags:

10 Layer HDI PCB

  

TG 170 HDI PCB

  

1.6 MM PCB

  
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