HASL FR4 TG170 Multi Layer Printed Circuit Board 8 Layer Pcb

HASL FR4 TG170 Multi Layer Printed Circuit Board 8 Layer Pcb

Multilayer Printed Circuit Board Multi Layer Circuit Board FR4 Printed Circuit Board Rigid Printed Circuit Boards

Multilayer Printed Circuit Board

Max layers: 32layer (≥20 layer needs to review)

Max finish panel size: 740* 500 MM(>600 MM needs to review)

Min finish panel size: 5 * 5mm
PCB material: PI +FR4,FR4, Rogers
PCB thickness: 0.2~4.0mm(＜0.2 mm,＞4 mm needs to review) (Board thickness ≤ 0.6mm,do not apply for HASL surface)

copper thickness of inner and outer base copper: Min 0.3/0.5oz,Max 3oz, advance 4-6oz

Bow and twist: 0.075%

Min. hole size: 0.15mm(＜0.15 mm needs to review)

HDI Min drill hole: 0.08-0.10MM
PCB track/gap: 3mil(0.075mm)
PCB outline: Routing/V-CUT/Punching

Solder mask thickness: standard 15-20um; Advanced: 35um

Min solder mask bridge width: green 4mil,other colour 4.8mil

Solder mask filling holes: 0.1-0.5mm

The color of solder mask: green,matt green,blue,matt blue,black,matt black,yellow,red,white,etc
PCB silkscreen: White, Black and as your request

Peelable mask thickness: 500-1000um
Oxidation film of OSP: 0.2-0.5um

Founded in 2010, Shenzhen Huashengxin Circuit is a professional manufacturer for printed circuit boards. HSX Circuit provides flexible quick turn production services (12hours to 72 hours), as well as small volume to big volume PCB manufacturing. Its products covers 1~32L FR-4 PCB, IMS PCB, HDI Boards, high frequency PTFE boards and Rigid-flex boards etc.

Under the support of high-educated and experienced team and advanced production equipment, HSX Circuit has won great reputation from the global markets because of its professional services and high quality products.

HSX Circuit covers a total production area of 10,000 square meters, employs more than 350 workers, produces over 5,000 PCB types monthly. Its products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.