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Wafer Dicing Blade

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wafer dicing blade

from 451 Products

Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade

China Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade on sale
...2mm ( D * H * T) We use resin powder to increase the flexibility of cutting blades in order to supply high performace of flexible cutting for many objects. such like to Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. Diamond ......
Shaanxi Tongyu Industry And Trade Co,.Ltd

Address: 329 North Chang'an Street, Chang'an District, Xi'an, China

Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw

China Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw on sale
...Wafer Dicing Machine Automatic Dicing Saw X-Axis Cutting Range 260mm Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades......
Shanghai GaNova Electronic Information Co., Ltd.

Address: Building 11, Lane 1333, Jiangnan Avenue, Changxing Town, Chongming District, Shanghai

DICING BLADES FOR HIGH-PRECISION SLICING AND DICING OF SOFT TO HARD MATERIALS OF MANY DIFFERENT TYPES AND ELEMENTS

China DICING BLADES FOR HIGH-PRECISION SLICING AND DICING OF SOFT TO HARD MATERIALS OF MANY DIFFERENT TYPES AND ELEMENTS on sale
Dicing Blades Dicing Blades, For High-Precision Slicing And Dicing Of Soft To Hard Materials Of Many Different Types And Elements Our blade technologies are designed and developed for high-precision slicing and dicing of soft to hard materials of many different types and elements, that are used in hard disk drive, optical, and semiconductor applications. Blades......
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Address: No. 26, Dongqing Street, High-tech Zone, Zhengzhou ,Henan, China

Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade

China Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade on sale
...Dicing Blades Metal Bonded Abrasives Dicing Saw Blade Product overview Metal bond dicing blades are made of identical material,with thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and narrow cutting depth. Specification 1A8/1 type, without water slot. 1A8/2 type, with water slot. Main features The grits are strongly held by the metal bond, high precision, minimized blade......
China Abrasives Industry Hainan Corporation

Address: Room 701-702, Dihao Building, Pearl River Plaza, Haikou City, Hainan Province, China

HWS Film Wafer Dicing Frame Packaging Custom

China HWS Film Wafer Dicing Frame Packaging Custom on sale
Product Description: Wafer Plastic Flex Frame Wafer Plastic Flex Frame is a kind of wafer frame with high quality material PPS, which is specially designed to match HWS Wafer Shipper. It has enough strength and toughness to transport and secure wafers. It......
Shenzhen Hiner Technology Co.,LTD.

Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Shajing Street,Baoan District,Shenzhen City,GD Province CN

Multifunctional Wafer Dicing Potato Wedges Cutting Machine For Wholesales

China Multifunctional Wafer Dicing Potato Wedges Cutting Machine For Wholesales on sale
Automatic Multipurpose Bacon Cooked Meat Slicing Machine Carrot Vegetable Slicer Machine Cooked meat slicer machine introduction: This machine is a machine for cutting cooked meat. It uses special three blades to cut barbecued pork, braised pork, pig scalp......
Henan Huafood Machinery Technology Co.,Ltd.

Address: Add:No.16 Industry Road,Er Qi District,Zhengzhou City,Henan,China.

Vegetable dicing blade baby side food stirring blade shred chopping knife vegetable blade

China Vegetable dicing blade baby side food stirring blade shred chopping knife vegetable blade on sale
... -- 68 HRc Our product range includes serrated, toothed, corrugated, curved, pointed, recessed, multi-edged and crank special blades or blades in a variety of shapes and...
Huaian Haoyang International Trading Co.,Ltd

Address: 11-B Block 26 district A, Huaihai Garden, Huaian City, Jiangsu Province, China

Silicon Paper Liner Wafer Dicing Tape for Precise Semiconductor Packaging

China Silicon Paper Liner Wafer Dicing Tape for Precise Semiconductor Packaging on sale
... resistant polyimide material and features a tensile strength of 25N/25mm, a thickness of 0.05mm and a size of 10mm*50m. This tape is suitable for wafer dicing, UV tape release and UV adhesive applications, making it an ideal choice for all types of...
Shenzhen KHJ Technology Co., Ltd

Address: KHJ Industrial park, Building 1,Chuangxin Industrial park, Xintian community, Guanlan, Longhua new district, Shenzhen,China 518110

Ultra - Thin Diamond Dicing Blades , Semiconductor Diamond Wafering Blade

China Ultra - Thin Diamond Dicing Blades , Semiconductor Diamond Wafering Blade on sale
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,...
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Address: 176#, The 7th Street, Economic & Technological Development Area. 450016, Zhengzhou, China

Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

China Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip on sale
... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Semi-auto dicing The semi-auto dicing system, refers to a dicing system...
YUSH Electronic Technology Co.,Ltd

Address: Building H, GuoRui Pioneering Park, No. 1068 Jinyang East Road, Lujia Town, Kunshan, Suzhou,Jiangsu,China.

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