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Blue Solder mask Pcb Prototype Assembly , Game SMT / DIP Assembly

Categories Circuit Board Assembly
Brand Name: HUASWIN
Model Number: HSPCBA1074
Certification: ISO/UL/RoHS
Place of Origin: China
MOQ: 1 sets
Price: Negotiation
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
Delivery Time: 15-20 working days
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
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    Blue Solder mask Pcb Prototype Assembly , Game SMT / DIP Assembly


    Blue Solder mask Pcb Prototype Assembly , Game SMT / DIP Assembly


    Blue Solder mask PCB Assembly Game Circuit Board Assembly SMT / DIP Assembly

    PCBA boards for game equipment


    Specifications

    1. PCB Assembly on SMT and DIP

    2. PCB schematic drawing/ layout /producing

    3. PCBA clone/change board

    4. Components sourcing and purchasing for PCBA

    5. Enclosure design and plastic injection molding

    6. Testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing, 3D Paste Thickness Test

    7. IC programing


    Quotation Requirement :


    Following specifications are needed for quotation:
    1) Base material:
    2) Board thickness:
    3) Copper thickness:
    4) Surface treatment:
    5) Color of solder mask and silkscreen:
    6) Quantity
    7) Gerber file &BOM

    Huaswin specialized in PCB manufacturing and and PCB Assembly


    PCBA capabilities:

    Fast prototyping
    High mix, low and medium volume build
    SMT MinChip:0201
    BGA: 1.0 to 3.0 mm pitch
    Through-hole assembly
    Special processes (such as conformal coating and potting)
    ROHS capability
    IPC-A-610E and IPC/EIA-STD workmanship operation


    Detailed Specification of PCB Manufacturing

    1

    layer

    1-30 layer

    2

    Material

    CEM-1, CEM-3 FR-4, FR-4 High TG,
    Polyimide,
    Aluminum-based
    material.

    3

    Board thickness

    0.2mm-6mm

    4

    Max.finished board size

    800*508mm

    5

    Min.drilled hole size

    0.25mm

    6

    min.line width

    0.075mm(3mil)

    7

    min.line spacing

    0.075mm(3mil)

    8

    Surface finish

    HAL, HAL Lead free,Immersion Gold/
    Silver/Tin,
    Hard Gold, OSP

    9

    Copper thickness

    0.5-4.0oz

    10

    Solder mask color

    green/black/white/red/blue/yellow

    11

    Inner packing

    Vacuum packing,Plastic bag

    12

    Outer packing

    standard carton packing

    13

    Hole tolerance

    PTH:±0.076,NTPH:±0.05

    14

    Certificate

    UL,ISO9001,ISO14001,ROHS,TS16949

    15

    Profiling punching

    Routing,V-CUT,Beveling


    PCB Assembly services:

    SMT Assembly


    Automatic Pick & Place
    Component Placement as Small as 0201
    Fine Pitch QEP - BGA
    Automatic Optical Inspection

    Through-hole Assembly


    Wave Soldering
    Hand Assembly and Soldering
    Material Sourcing
    IC pre-programming / Burning on-line
    Function testing as requested
    Aging test for LED and Power boards
    Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
    Packing design


    Conformal coating


    Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
    applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
    contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
    When coated, it is clearly visible as a clear and shiny material.


    Complete box build


    Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
    plastics, casings and print & packaging material


    Testing Methods


    AOI Testing
    Checks for solder paste
    Checks for components down to 0201"
    Checks for missing components, offset, incorrect parts, polarity
    X-Ray Inspection
    X-Ray provides high-resolution inspection of:
    BGAs
    Bare boards


    In-Circuit Testing
    In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
    component problems.

    Power-up Test
    Advanced Function Test
    Flash Device Programming
    Functional testing


    Quality Processes:


    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection (FAI) for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

    Product Tags:

    printed circuit assembly

      

    pcba assembly

      
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